MIL-DTL-83513 Micro-D Receptacle (Solder Cup)

Specifications

Cross-Reference

Overview

The M83513/02-AP is a MIL-DTL-83513 Micro-D receptacle with nine socket contacts on 0.050 in (1.27 mm) centres — the same contact pitch as a standard D-subminiature, packed into a shell roughly half the size and weight. The /02 slash sheet is the solder-cup receptacle, terminated by hand or in low volume to AWG 26 wire and finer, and it mates with an M83513/01-series plug carrying pin contacts. Contacts are non-removable gold-plated TwistPin types, which is why Micro-D connectors maintain low mating force and high contact reliability even under shock and vibration.

The finish suffix letter is a two-part code: the first letter is the shell size (A = 9 contacts, B = 15, C = 21, D = 25, E = 31, F = 37, G = 51, H = 100) and the second is the shell finish — C for cadmium, N for electroless nickel and P for passivated stainless steel, the cadmium-free option used where RoHS, REACH or a non-magnetic requirement rules out cadmium plating. Passivated stainless shells are dimensionally identical to the cadmium-plated parts, so they drop into the same panel cut-out and use the same hardware.

MIL-DTL-83513 covers eight standard layouts from 9 to 100 contacts, with three families of termination: solder cup (/01 and /02), pre-wired pigtail, and PCB tails (/10 through /33) in straight, 90-degree and condensed 90-degree mounting. The connector is rated -55°C to +125°C, 3 A maximum per contact, and 500 mating cycles. Because Micro-D was originally specified for military avionics and space, it is also widely used in geophysical, medical and industrial instrumentation where a compact high-reliability signal interface is needed.

Applications

Avionics and satellite signal interconnect, missile and radar subsystems, space-grade payload harnesses, medical imaging and geophysical instrumentation, unmanned platforms, and any compact high-density signal interface where a standard D-sub is too large or too heavy.