MIL-DTL-83513 equivalent. 1.27×2.54mm grid. 9–144 contacts. -55°C to +125°C. Military electronics, satellite systems, avionics. High-density signal interconnect.
MIL-DTL-83513 equivalent. 1.27×2.54mm grid. 9–144 contacts. -55°C to +125°C. Military electronics, satellite systems, avionics. High-density signal interconnect.
1.27×2.54mm
9 to 144
-55°C to +125°C
3A per contact
≤10mΩ
| Part Number | Contacts | Type | Current | Resistance | Application |
|---|---|---|---|---|---|
| KJ30J-51ZK-P-G | 51-Pin | Crimp, Cadmium | 3A | ≤10mΩ | Military electronics, missile systems |
| KJ30J-9TJN-PCB | 9-Pin | Straight PCB Mount | 3A | ≤10mΩ | Compact PCB interconnect, avionics |
| KJ30J-100ZK-P | 100-Pin | Crimp, Nickel | 3A | ≤10mΩ | High-density signal, satellite bus |
Free samples. Cross-brand compatible. 4-week lead time. info@airoadcon.com